Irregular Electrodeposition of Cu-Sn Alloy Coatings in [EMIM]Cl Outside the Glove Box with Large Layer Thickness

Thick Cu−Sn alloy layers were produced in an [EMIM]Cl ionic-liquid solution from CuCl2 and SnCl2 different ratios. All work, including the electrodeposition, took place outside glovebox with a continuous argon stream over electrolyte at 95 °C. The layer composition thickness can be adjusted by variation of metal-salts content electrolyte. A up to 15 µm copper ωCu = 0.86 was obtained. phase characterized scanning electron microscopy (SEM), X-ray diffraction (XRD), fluorescence (XRF). Furthermore, it found that relationship between concentration ions is described as irregular system according Brenner. Brenner such systems only for aqueous electrolytes containing complexing agents cyanide. In this confirmed depositions also occur [EMIM]Cl.